GDM300晶圆研磨（Wafer Grinding）衡鹏
——又称晶圆抛光/晶圆背抛/晶圆减薄






GDM300晶圆研磨（Wafer Grinding）特长：
·The process from back grinding to wafer mounting continuously by fully automatic system, Which enable to grind till 25um thickness.
·Built in edge trimming system is available as an option for thin wafer process.
·Dual index system, which polishing stage and grinding stage is completely separated, satisfy the cleanness required for TSV and MEMS process.
·Less than Ra1A ultra luminance, ultra mirror surface is possible.






GDM300晶圆研磨（Wafer Grinding）相关产品：
衡鹏供应
GNX200BP晶圆研磨/晶圆减薄/晶圆抛光/晶圆背抛/Wafer Grinding